Semiconductor Resources – NexION 2000
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Chemical mechanical planarization (CMP) is a process for polishing wafer surfaces used in semiconductor manufacturing. It uses a slurry containing both nanoparticles and functional chemicals. Cerium dioxide (CeO2) particles are commonly used in CMP slurries, and the sizes of the particles in the slurry are extremely important.
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During the production of semiconductor devices, a series of acids are commonly used for a variety of processes. One of the more important chemicals is hydrochloric acid (HCl), whose primary use is to clean the surface of silicon wafers as part of a mixture with hydrogen peroxide and water.
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With the increased use of nanoparticles (NPs) in various products and processes, the need to characterize them has also increased. Single Particle ICP-MS (SP-ICP-MS) was developed for rapid analysis of nanoparticles, measuring thousands of particles in less than a minute, while providing individual particle information on particle size, particle size distribution, particle concentration, dissolved concentration of the element, and agglomeration.