Analysis of Metallic Impurities in Organic Solvents Used in IC Fabrication with the NexION 5000 ICP-MS | PerkinElmer
PerkinElmer
Metallic Impurities in Organic Solvents Used in IC Fabrication with the NexION 5000 ICP-MS

Application Note

Analysis of Metallic Impurities in Organic Solvents Used in IC Fabrication with the NexION 5000 ICP-MS

Metallic Impurities in Organic Solvents Used in IC Fabrication with the NexION 5000 ICP-MS

Introduction

The most commonly used organic chemicals in integrated circuit (IC) fabrication are isopropyl alcohol (IPA), propylene glycol methyl ether acetate (PGMEA), propylene glycol methyl ether (PGME), and n-methyl pyrrolidone (NMP). These solvents can leave behind organic film residues with metallic and non-metallic contamination on the wafers, so high-purity grades are mandated for advanced semiconductor processes.

This application note describes the analysis of 46 elements in IPA, PGMEA and NMP using the NexION® 5000 Multi-Quadrupole ICP-MS. This platform is the first in its category to boast four quads, delivering exceptionally low background equivalent concentrations and outstanding detection limits, enabling the semiconductor industry to quantify contaminants in acidic, basic, and organic chemicals at extremely low levels.